Principal PCB & Substrate Layout Engineer
Position Overview
We are seeking an experienced Principal PCB & Substrate Layout Engineer to provide technical leadership and hands-on expertise in the design and development of advanced printed circuit boards, high-density substrates, and microelectronic packaging solutions. This role will support complex electronic systems requiring high-speed interfaces, high-density interconnect technologies, and advanced packaging architectures.
The successful candidate will serve as a technical leader, driving layout excellence, supporting multidisciplinary engineering teams, and ensuring designs are optimized for performance, manufacturability, reliability, and quality.
Key Responsibilities
Technical Leadership
- Provide technical leadership for PCB and substrate layout activities focused on high-speed interfaces and high-density packaging technologies.
- Drive continuous improvement of layout methodologies, design processes, and best practices.
- Mentor engineers and layout designers while supporting complex development programs.
PCB & Substrate Design
- Lead the design, layout, and analysis of complex electrical and mechanical systems, including:
- High-density interposers
- Advanced substrates
- Multi-layer PCBs
- Flip-chip architectures
- Digital, analog, power, and RF signal routing
- Develop designs utilizing:
- High-Density Interconnect (HDI) technologies
- Blind and buried vias
- Ball Grid Arrays (BGAs)
- Differential pair routing
- Controlled impedance structures
- Design for Test (DFT)
- Electromagnetic Compatibility (EMC) principles
- Perform stack-up development, impedance calculations, crosstalk analysis, and material selection studies.
- Support package material characterization and modeling, including:
- Skin effect analysis
- Surface roughness considerations
- Dielectric constant and loss evaluation
- Frequency-dependent material modeling
Manufacturing & Supplier Support
- Apply Design for Manufacturing (DFM) principles and ensure layouts align with supplier capabilities.
- Develop fabrication documentation and drawings that accurately communicate design intent.
- Support fabrication and assembly suppliers throughout the manufacturing process.
- Validate manufacturing deliverables using CAM tools and industry best practices.
- Review artwork and manufacturing documentation throughout the design lifecycle.
Cross-Functional Collaboration
- Participate in design reviews, manufacturing readiness reviews, and technical evaluations.
- Support multidisciplinary investigations, feasibility studies, and technology development efforts.
- Collaborate with:
- Electrical Engineering
- Mechanical Engineering
- Manufacturing Operations
- Quality
- Supply Chain
- Customers
- Suppliers and fabrication partners
- Provide technical guidance to internal and external stakeholders throughout product development.
CAD & Documentation Responsibilities
- Create and maintain assembly drawings using AutoCAD.
- Develop, manage, and maintain DX Designer/CAE component libraries.
- Coordinate CAD data and design packages with external PCB layout vendors.
- Define and implement CAD methodologies, software applications, and design standards.
- Develop automation scripts and utilities to improve engineering tool efficiency.
- Ensure fabrication drawings accurately reflect engineering requirements and specifications.
- Support footprint development and component library management for PCB design.
- Provide schematic support to the Electrical Engineering organization.
- Evaluate supplier capabilities and support material, equipment, and service selections.
Required Qualifications
- Bachelor's degree in Engineering or equivalent combination of education and experience.
- Minimum 10 years of experience in PCB and/or high-density package layout design.
- Expert-level experience with Cadence APD+ (Allegro) and associated layout tools.
- Experience with APD+ Physical and Electrical Constraint Editor.
- Extensive experience designing:
- High-Density Interconnect (HDI) structures
- Blind and buried micro-vias
- Specialty RF dielectric materials
- Fine-line routing technologies down to 2μm/2μm geometries
- Experience with advanced packaging technologies including:
- 2.5D devices
- Interposer design
- Substrate design
- Flip-chip packaging
- Die stacking
- Package stacking
- Substrate stacking
- Experience with schematic and netlist-driven layout processes.
- Strong understanding of digital, analog, and RF layout methodologies.
- Knowledge of electronic packaging technologies and advanced semiconductor packaging concepts.
- Experience collaborating with Mechanical Engineering teams on 3D modeling, fit checks, and thermal integration.
- Experience using CAM tools for manufacturing validation.
- Working knowledge of JEDEC and IPC standards for design, fabrication, and assembly.
- Experience creating fabrication packages and assembly documentation.
Preferred Qualifications
- Experience with CAM350, Blueprint, or similar manufacturing validation tools.
- High-end FPGA package or board design experience.
- Experience supporting aerospace, defense, space, telecommunications, semiconductor, or other highly regulated industries.
- Familiarity with advanced microelectronics manufacturing processes.
- Experience supporting highly reliable or mission-critical electronic systems.
Desired Skills
- Strong technical leadership and mentoring capabilities.
- Excellent analytical and problem-solving skills.
- Ability to evaluate complex technical issues and develop practical solutions.
- Strong communication and collaboration skills.
- Commitment to quality, execution, and continuous improvement.
- Ability to thrive in a fast-paced, multidisciplinary engineering environment.
- Systems-thinking mindset with the ability to understand impacts across the full product lifecycle.
- Willingness to support team objectives beyond individual areas of expertise.
Additional Requirements
- Must be eligible to work in the United States.
- Ability to work effectively both independently and within cross-functional teams.
EOE (including Disability/Veterans)
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