Senior Process Engineer - Advanced Packaging & Manufacturing

Austin, Texas | On-site

Opportunity Summary

A venture-backed deep technology company is developing advanced photonic and electronic hardware systems for next-generation computing, communications, aerospace, and national security applications. The products combine sophisticated semiconductor technologies, advanced materials, precision assembly processes, and automated manufacturing techniques to deliver performance and scalability beyond conventional hardware architectures. We are seeking a Senior Process Engineer to lead the development, qualification, and optimization of critical manufacturing and packaging processes that enable these products to move from development into high-volume production. This individual will play a key role in scaling technologies that may ultimately support data center infrastructure, space-based systems, communications networks, and other mission-critical applications.

About Us

We are an early-stage technology company building advanced hardware platforms at the intersection of photonics, electronics, and manufacturing. Our team is focused on solving challenging engineering problems that require precision manufacturing, high-reliability packaging, and scalable production processes. The technologies being developed have the potential to support a broad range of commercial and government applications, including next-generation computing infrastructure, aerospace systems, and communications platforms. We operate in a hands-on, engineering-driven environment where ownership, execution, and continuous improvement are highly valued. Team members have the opportunity to help shape both the technology and the manufacturing systems required to bring it to scale.

Job Duties

• Lead development and qualification of advanced manufacturing, assembly, and packaging processes from prototype through volume production
• Own process development activities including equipment selection, material evaluation, recipe creation, process characterization, and optimization
• Develop and implement statistical process control methodologies to improve process stability, quality, throughput, and yield
• Partner with design, electrical, mechanical, and manufacturing teams to ensure products are designed for manufacturability and production scale
• Translate product and package designs into robust, repeatable manufacturing processes
• Establish process windows, operating limits, and manufacturing specifications for critical production operations
• Design and execute process characterization studies to validate performance, reliability, and manufacturability
• Perform root cause investigations, failure analysis, and corrective action implementation to address process and product issues
• Analyze manufacturing and yield data to identify opportunities for continuous improvement
• Support equipment qualification, process transfer, supplier engagement, and manufacturing ramp activities
• Develop process documentation, work instructions, engineering standards, and production procedures
• Provide technical mentorship and guidance to engineers, technicians, and manufacturing personnel

Qualifications

• Master's degree or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related technical discipline
• 3+ years of hands-on process development experience within semiconductor, microelectronics, advanced manufacturing, or related industries
• Strong troubleshooting and problem-solving skills within manufacturing or development environments
• Experience developing and qualifying production processes from concept through implementation
• Hands-on experience with semiconductor packaging, wafer processing, advanced assembly, precision manufacturing, or related technologies
• Experience applying statistical process control, process capability analysis, and continuous improvement methodologies
• Ability to analyze process data and make data-driven engineering decisions
• Comfortable working in cleanroom, laboratory, and controlled manufacturing environments
• Experience collaborating across multidisciplinary engineering teams
• Willingness to support critical development and production milestones when required

Preferred Experience

• 6+ years of experience in semiconductor manufacturing, wafer-level packaging, photonics, microelectronics, or advanced packaging environments
• Experience with wafer processing technologies such as lithography, deposition, etch, polishing, dicing, bonding, or related fabrication processes
• Experience with advanced assembly techniques including die attach, flip-chip bonding, wire bonding, precision alignment, or automated assembly systems
• Familiarity with materials characterization and failure analysis tools such as X-ray inspection, SEM, CSAM, FIB, die shear testing, or related methods
• Experience supporting manufacturing scale-up and production ramp efforts
• Knowledge of reliability testing, qualification methodologies, and process validation techniques
• Experience working with highly automated manufacturing equipment and production environments
• Familiarity with advanced photonic, optoelectronic, or high-performance computing hardware systems

Why Join Us

• Opportunity to help build manufacturing capabilities for next-generation computing, communications, and aerospace technologies
• Significant ownership over process development and production strategy
• Direct impact on product performance, reliability, and scalability
• Exposure to challenging multidisciplinary engineering problems at the intersection of hardware and manufacturing
• Equity participation and long-term growth potential within a rapidly growing startup
• Collaborative, execution-focused environment where strong technical contributions have immediate impact

Compensation Details

$140,000 - $180,000

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