We're looking for a 2.5D Advanced Semiconductor Assembly Engineer to provide technical engineering support for Advanced Packaging Material products and be responsible for developing in-depth application knowledge for the electronics market.

RESPONSIBILITIES:

• Be the technical lead on developmental and commercialized products by optimization of material application processes, and direct interaction with customers to troubleshoot and solve product and process related problems.
• Ensure that new and existing products can be successfully employed by the customers in a manner that brings clear and identifiable value.
• Solve technology-specific fundamental problems associated with entire product lines and/or product classes by novel approaches to application process development, troubleshooting, and material characterization.

BACKGROUND PROFILE:

• Minimum of a Bachelor’s degree in Material Science/Engineering, Mechanical Engineering, Chemical Engineering, or other related fields.
• 10+ years of experience working in a chemical for semiconductor advanced packaging environment.
• Good understanding for the latest Semiconductor Packaging trend. Especially 2.5D and 3D package.
• Expertise in wafer level encapsulation and molding process in semiconductor package.
• Strong verbal communication skills one-on-one with colleagues/customers as well as in front of groups with solid interpersonal skills, with ability to work as a team member and independently on multi-task assignments.
• Strong ownership and responsibility with customer-oriented mindset and good understanding of customer request & culture.
• Effective in using project and time management skills to drive projects to completion and focus on commitment to deliver the highest level of quality work consistently.
• Traveling of up to 10% will be part of this role.