The Principal Engineer-Bare Die Packaging will develop materials for semiconductor packaging and apply expertise in designing, testing and optimizing products that meet the high demands of the electronics industry. This role involves hands-on experimentation, data-driven analysis, and collaboration across teams to bring innovative materials from concept to high-volume production.

RESPONSIBILITIES:

• Lead key subsystems in the development of Thermal Interface Material (TIM) products for semiconductor packaging applications.
• Utilize strong engineering fundamentals and materials science expertise to identify existing and future product issues affecting customers.
• Draw upon experience in electronics or semiconductor packaging to generate a range of material and system-level solutions.
• Design and execute experiments to quickly rule in or out potential solutions, including both rapid preliminary tests and comprehensive, strategically designed experiments.
• Think creatively and innovatively to solve complex technical challenges and improve product performance.
• Analyze experimental data to make data-driven decisions and adjust technical priorities accordingly.
• Collaborate with cross-functional teams to integrate solutions into the product development process and manufacturing.
• Stay updated on industry trends and advancements to proactively address potential future challenges.

BACKGROUND PROFILE:

• Minimum BS in Materials Engineering or a related field.
• 7+ years of experience in materials development for the electronics or semiconductor packaging industry.
• Proven ability to identify complex product issues and develop innovative solutions.
• Strong understanding of process-structure-property relationships in materials development.
• Strong fundamental knowledge of metallurgy and polymer systems.
• Experience with semiconductor reliability testing (temperature cycling, HAST, shock and vibration, etc.)
• Experience transitioning product developments into high-volume production.
• Strong written and verbal communication skills, with the ability to communicate technical information to both technical and non-technical audiences.
• Ability to manage multiple projects simultaneously and adapt to changing priorities.